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Most recent Events

Tyco Shipment

Most recent Presentations

Micrel addresses the DryZone technology
Presentation Reference from VTT for the Coldstrip Process
March 2008 Investor Kit
Organostrip Presentation

Events

Tyco Shipment

Mar 01, 2008


Station 2 Shipment

Presentations

Micrel addresses the DryZone technology

Aug 05, 2008


Click here to view presentation.

Presentation Reference from VTT for the Coldstrip Process

Aug 05, 2008


Behavior of Aluminum in Ozonated Water, Optical and Electrochemical Study

Heini Ritala, Kimmo Solehmainen and Leif Grönberg
VTT Information Technology
P.O.Box 1208, 02044 VTT, Finland 

4:45

818

Behavior of Aluminum in Ozonated Water, Optical and Electrochemical Study -
H. Ritala, K. Solehmainen, L. Grönberg (VTT Information Technology), and A. Pehkonen (Helsinki University of Technology)

March 2008 Investor Kit

Mar 18, 2008


link file here.

Organostrip Presentation

Feb 28, 2008


Applied Materials Presentation at Electro Chemical Society

LOG-3ST

Ozone Generation System

A flexible design of Ozone Equipment permits the delivery of ozone gas streams to single or multiple use points or the delivery of single or multiple ozonated water streams to multiple use points.  The Ozone hardware is used in traditional batch wafer wetstations, batch wafer spray stations, and single wafer processing equipment to deliver ozone gas for in-situ chemical formation or liquid ozonated solutions to the process chambers.  Ozone generators with production ranges from 10g/hr to 500g/hr are configured on an as needed basis.

The systems are used to remove Photoresist, Organic Contamination removal in Prediffusion Cleans, and to Passivate Silicon Surfaces

Why we're the best!

Customer Success 

  • Process - Gate Oxide Cleaning
  • Equipment - LOG-3ST
  • Results - Yield Increase Range 1.7% - 12.2% 

Generation III

ColdStrip ™

The system utilizes only water and oxygen as raw materials.  It has the lowest cost of ownership of any wet resist strip process, saving over $300,000 per year per wetstation  when compared to a sulfuric:peroxide system.  The key process parameters are water temperature, ozone dispersion, and ozone concentration.  This photoresist stripping mechanism for Coldstrip™ doesn’t lift carbon resists off the wafers into solution, but digests and oxidizes the photoresist to soluble chemistries and gaseous carbon dioxide.  Particles due not build up in solution and redeposit on wafers as is customary with conventional sulfuric acid mixtures or solvent strippers