Products
Automated Wetstations
Advanced Fully Automated Wetstations with Cassette-less Wafer Handling Automation
Legacy’s advanced process technology is delivered in an integrated wet platform that combines cassette-less wafer automation, in-situ gas technology, and state of the art fluid dynamics. Automated wetstations have enclosed mini-environments with active ULPA filtration air handlers to provide a safe haven for exposed wafers and to provide a barrier between fab operators and chemicals.
Operators place fab cassettes in a designated load position, select a recipe on a touch screen or via a bar code reader, and press start to execute the process sequence. Advanced wafer handling robotics automatically process multiple wafer sizes (or wafer thicknesses), handle wet or dry incoming substrates and produce dry outgoing substrates, and has the capability to change the pitch between wafers when required to load out going half pitch silicon carbide or quartz furnace boats automatically.
Chemicals, both liquids and gases are either premixed or mixed in-situ to provide the most cost effective and infinite selection of purified chemicals or chemical blends. The on-board chemical delivery and blending systems reduce chemical consumption and offer the highest cost of ownership of any wetstation.
Even the process tanks are integrated with the wafer handling system to enhance fluid dynamics thereby minimizing both chemical and water consumption, while enhancing process uniformity and reducing particle contamination.
The reliability of the station has been proven in customer fabs, where 50,000 wafers have been processed without any station errors or operator attention. In many fabs, this represents a years worth of wafer production.
Each station is PC to PLC controlled and interfaced though a touchscreen monitor with color graphics.
LOG-3ST
Ozone Generation System
A flexible design of Ozone Equipment permits the delivery of ozone gas streams to single or multiple use points or the delivery of single or multiple ozonated water streams to multiple use points. The Ozone hardware is used in traditional batch wafer wetstations, batch wafer spray stations, and single wafer processing equipment to deliver ozone gas for in-situ chemical formation or liquid ozonated solutions to the process chambers. Ozone generators with production ranges from 10g/hr to 500g/hr are configured on an as needed basis.
The systems are used to remove Photoresist, Organic Contamination removal in Prediffusion Cleans, and to Passivate Silicon Surfaces
Why we're the best!
Customer Success
- Process - Gate Oxide Cleaning
- Equipment - LOG-3ST
- Results - Yield Increase Range 1.7% - 12.2%
Generation III
ColdStrip ™
The system utilizes only water and oxygen as raw materials. It has the lowest cost of ownership of any wet resist strip process, saving over $300,000 per year per wetstation when compared to a sulfuric:peroxide system. The key process parameters are water temperature, ozone dispersion, and ozone concentration. This photoresist stripping mechanism for Coldstrip™ doesn’t lift carbon resists off the wafers into solution, but digests and oxidizes the photoresist to soluble chemistries and gaseous carbon dioxide. Particles due not build up in solution and redeposit on wafers as is customary with conventional sulfuric acid mixtures or solvent strippers
