Products

Ozone Generators

Single Process Tank Ozone Generator

Ozone gas output to single process tank or use point: Low flow ozone generator supplies oxidant to one process tank.

For use with sulfuric-ozone resist strip processes or surface conversion of hydrophobic to hydrophilic wafers or light organic cleaning.

Multiple Process Tank Ozone Generator

Ozone gas output to multiple process tanks (1-4) or use points: High flow ozone generator supplies oxidant to one, two, or three process tanks.

For use with sulfuric-ozone photoresist strip processes or surface conversion of hydrophobic to hydrophilic wafers or light organic cleaning.

 

   

 

 

 

 

LOG-3ST

Ozone Generation System

A flexible design of Ozone Equipment permits the delivery of ozone gas streams to single or multiple use points or the delivery of single or multiple ozonated water streams to multiple use points.  The Ozone hardware is used in traditional batch wafer wetstations, batch wafer spray stations, and single wafer processing equipment to deliver ozone gas for in-situ chemical formation or liquid ozonated solutions to the process chambers.  Ozone generators with production ranges from 10g/hr to 500g/hr are configured on an as needed basis.

The systems are used to remove Photoresist, Organic Contamination removal in Prediffusion Cleans, and to Passivate Silicon Surfaces

Why we're the best!

Customer Success 

  • Process - Gate Oxide Cleaning
  • Equipment - LOG-3ST
  • Results - Yield Increase Range 1.7% - 12.2% 

Generation III

ColdStrip ™

The system utilizes only water and oxygen as raw materials.  It has the lowest cost of ownership of any wet resist strip process, saving over $300,000 per year per wetstation  when compared to a sulfuric:peroxide system.  The key process parameters are water temperature, ozone dispersion, and ozone concentration.  This photoresist stripping mechanism for Coldstrip™ doesn’t lift carbon resists off the wafers into solution, but digests and oxidizes the photoresist to soluble chemistries and gaseous carbon dioxide.  Particles due not build up in solution and redeposit on wafers as is customary with conventional sulfuric acid mixtures or solvent strippers